Behind the Build: Exploring Lexar’s 30 Years of Innovation and the Longsys Ecosystem
Author: Dennis GarciaVisit to Longforce
Longforce is a collaboration between Longsys and the Taiwan based PTI to operate a Packaging and Testing facility in Suzhou. Packaging is the process that converts a raw silicon chip into something that can be used. For instance, the chips you see on DDR memory are actually packaged silicon providing a protective cover over the silicon chip while adding the individual data and power points to run.
Packaging is actually a rather involved process that includes taking a silicon wafer from the chipmaker, sanding it down to the desired thickness, using a high-resolution scanner to identify a chip free of defects.
From there the chip is set in the desired package and then goes to a station that will run microscopic gold wire from the silicon to the individual pad points on the package. This is what enables the chip to operate and the size and format of the packaging will determine how the chip is used.
BGA chips have a series of solder balls under the package that will then be surfaced mounted to the PCB. The number of solder points will change between memory and controller chips and is one of the more delicate aspects of BGA packaging.
Other packaging methods include die stacking where multiple dies are vertically stacked in a single package increase storage density. Many of these processes are for embedded and automotive systems where space is at a premium.
Of course, once the chip has been laced up it is put through a series of functional tests before the packaging process is finished.
As part of our tour, we all got dressed up in clean room suits and could walk the manufacturing floor. You can read about chipmaking all day long but until you see the machines in action you can never fully understand the process that makes the chips that power your storage devices.
BTW, neither of the photos above feature "me" but does represent the bunny suit and the chip wafers that are sliced up to build an individual "chip".
Suzhou is a rather famous place in China and features another tall and extremely famous building called “The Gate to the East” or “Gate of the Orient”. This building was completed in 2016 and marks the east-west intersection of Suzhou Old Town.

